Inventor · disambiguated record
Gor Lai
Also filed as: LAI GOR A · LAI GOR AMIE
3 granted patents·1 pending application·9 citations·filing 2005–2006
62Inventor score
Top patents by PatentIndex Score
4 records- 0167US7279409B2Method for forming multi-layer bumps on a substrateFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Oct 9, 2007·4 cites·13 claims
- 0264US7422973B2Method for forming multi-layer bumps on a substrateFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Sep 9, 2008·3 cites·18 claims
- 0360US7494924B2Method for forming reinforced interconnects on a substrateFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Feb 24, 2009·2 cites·9 claims
- 0435US2006208344A1Lead frame panel and method of packaging semiconductor devices using the lead frame panelSHIU HEI M·Filed 2005·Application pending·0 cites
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