Inventor
CHEN YIN-JU
TW19 patents
⚠️ This page may combine multiple inventors who share the name “CHEN YIN-JU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNIMICRON TECHNOLOGY CORP
11 patentsUS9514629B2Dec 6, 2016
Vehicle door opening warning system and vehicle door opening warning method
UNIMICRON TECHNOLOGY CORP27 citations93
US9491865B1Nov 8, 2016
Circuit board and method for manufacturing the same
UNIMICRON TECHNOLOGY CORP8 citations83
US9635757B1Apr 25, 2017
Circuit board and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP17 citations82
US10616992B2Apr 7, 2020
Circuit board and method for manufacturing the same
UNIMICRON TECHNOLOGY CORP2 citations72
US9159713B1Oct 13, 2015
Opto-electronic circuit board and method for assembling the same
UNIMICRON TECHNOLOGY CORP2 citations61
US9883598B2Jan 30, 2018
Circuit board and method for manufacturing the same
UNIMICRON TECHNOLOGY CORP0 citations51
US9805875B2Oct 31, 2017
Capacitor and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations51
US9739963B2Aug 22, 2017
Manufacturing method of optical component
UNIMICRON TECHNOLOGY CORP0 citations51
US9581774B2Feb 28, 2017
Optical-electro circuit board
UNIMICRON TECHNOLOGY CORP0 citations51
US9377596B2Jun 28, 2016
Optical-electro circuit board, optical component and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations51
US9335470B2May 10, 2016
Opto-electronic circuit board and method for assembling the same
UNIMICRON TECHNOLOGY CORP0 citations40
AALTOSEMI INC
4 patentsUS12550765B2Feb 10, 2026
Package substrate and fabricating method thereof
AALTOSEMI INC0 citations48
US12557664B2Feb 17, 2026
Electronic package and fabricating method thereof
AALTOSEMI INC0 citations45
US12550796B2Feb 10, 2026
Electronic package and fabricating method thereof
AALTOSEMI INC0 citations45
US12550767B2Feb 10, 2026
Package substrate and fabricating method thereof
AALTOSEMI INC0 citations44