Inventor
BUNT JAY A
US14 patents
⚠️ This page may combine multiple inventors who share the name “BUNT JAY A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
13 patentsUS10842043B1Nov 17, 2020
Fabricating coolant-cooled heat sinks with internal thermally-conductive fins
IBM22 citations91
US11191155B1Nov 30, 2021
Tamper-respondent assembly with structural material within sealed inner compartment
IBM16 citations84
US11156409B2Oct 26, 2021
Coolant-cooled heat sinks with internal thermally-conductive fins joined to the cover
IBM6 citations71
US11158562B2Oct 26, 2021
Conformal integrated circuit (IC) device package lid
IBM1 citations61
US12005148B2Jun 11, 2024
Coolant-cooled heat sink(s) with associated ultra-violet light assembly
IBM0 citations60
US11940271B2Mar 26, 2024
High power device fault localization via die surface contouring
IBM0 citations60
US12581600B2Mar 17, 2026
Generation of random security circuit patterns for in-situ fabrication of tamper-respondent sensors
IBM0 citations59
US11614324B2Mar 28, 2023
Non-destructive bond line thickness measurement of thermal interface material on silicon packages
IBM0 citations59
US11430710B2Aug 30, 2022
Lid/heat spreader having targeted flexibility
IBM0 citations59
US7836935B2Nov 23, 2010
Apparatus for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriers
IBM3 citations58
US12274966B2Apr 15, 2025
Filter device having multiple changeable filter surfaces
IBM0 citations55
US11716808B2Aug 1, 2023
Tamper-respondent assemblies with porous heat transfer element(s)
IBM0 citations49
US7947143B2May 24, 2011
Method for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriers
IBM0 citations48