Inventor

ALVAREZ SHEILA MARIE L

SG24 patents

⚠️ This page may combine multiple inventors who share the name “ALVAREZ SHEILA MARIE L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ALVAREZ SHEILA MARIE L

STATS CHIPPAC LTD

Semiconductor device having wire studs as vertical interconnect in FO-WLP

Integrated circuit package system employing device stacking

Integrated circuit package system with downset lead

Etched leadframe flipchip package system

Semiconductor package with controlled solder bump wetting and fabrication method therefor

Semiconductor device and method of forming RDL and vertical interconnect by laser direct structuring

Etched leadframe flipchip package system

Semiconductor package with selective underfill and fabrication method therfor

Semiconductor package with controlled solder bump wetting

Integrated circuit encapsulation system with vent

ST ASSEMBLY TEST SERVICES LTD

Heat spreaders, heat spreader packages, and fabrication methods for use with flip chip semiconductor devices

Strip-fabricated flip chip in package and flip chip in system heat spreader assemblies and fabrication methods therefor

Fabrication method for semiconductor package heat spreaders

Heat spreader for thermally enhanced semiconductor package

CAMACHO ZIGMUND RAMIREZ

Integrated circuit packaging system with photoimagable dielectric-defined trace and method of manufacture thereof

Integrated circuit packaging system with pre-molded leadframe and method of manufacture thereof

STATS CHIPPAC PTE LTD

Semiconductor device and method of forming wire studs as vertical interconnect in FO-WLP

Integrated circuit packaging system with photoimagable dielectric-defined trace and method of manufacture thereof

CHI HEEJO

Integrated circuit packaging system with support structure and method of manufacture thereof

Integrated circuit packaging system with insulated trace and method of manufacture thereof

DAHILIG FREDERICK RODRIGUEZ

Integrated circuit package system employing device stacking

Integrated circuit package system employing device stacking and method of manufacture thereof

LEE JAE SOO

Semiconductor flip chip package having substantially non-collapsible spacer and method of manufacture thereof

ARARAO VIRGIL COTOCO

Semiconductor package heat spreader