Inventor
MARSTON KENNETH C
US21 patents
⚠️ This page may combine multiple inventors who share the name “MARSTON KENNETH C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
14 patentsUS7928562B2Apr 19, 2011
Segmentation of a die stack for 3D packaging thermal management
IBM58 citations97
US7834442B2Nov 16, 2010
Electronic package method and structure with cure-melt hierarchy
IBM24 citations92
US10757833B2Aug 25, 2020
Cooling structure for electronic boards
IBM7 citations84
US10172258B2Jan 1, 2019
Cooling structure for electronic boards
IBM5 citations84
US9721870B2Aug 1, 2017
Cooling structure for electronic boards
IBM5 citations84
US7917328B2Mar 29, 2011
Tracking thermal mini-cycle stress
IBM8 citations82
US7239516B2Jul 3, 2007
Flexure plate for maintaining contact between a cooling plate/heat sink and a microchip
IBM7 citations73
US10342160B2Jul 2, 2019
Heat sink attachment on existing heat sinks
IBM2 citations72
US9883612B2Jan 30, 2018
Heat sink attachment on existing heat sinks
IBM5 citations72
US8363404B2Jan 29, 2013
Implementing loading and heat removal for hub module assembly
IBM5 citations72
US10905029B2Jan 26, 2021
Cooling structure for electronic boards
IBM0 citations62
US11430710B2Aug 30, 2022
Lid/heat spreader having targeted flexibility
IBM0 citations59
US10542636B2Jan 21, 2020
Cooling structure for electronic boards
IBM0 citations52
US11164804B2Nov 2, 2021
Integrated circuit (IC) device package lid attach utilizing nano particle metallic paste
IBM0 citations47
CASEY JON A
3 patentsUS8421217B2Apr 16, 2013
Achieving mechanical and thermal stability in a multi-chip package
CASEY JON A19 citations90
US8202765B2Jun 19, 2012
Achieving mechanical and thermal stability in a multi-chip package
CASEY JON A28 citations90
US8214658B2Jul 3, 2012
Enhanced thermal management for improved module reliability
CASEY JON A4 citations61
BEZAMA RASCHID JOSE
2 patentsUS8115303B2Feb 14, 2012
Semiconductor package structures having liquid coolers integrated with first level chip package modules
BEZAMA RASCHID JOSE28 citations91
US8772927B2Jul 8, 2014
Semiconductor package structures having liquid cooler integrated with first level chip package modules
BEZAMA RASCHID JOSE12 citations83