Inventor

MUNCY JENNIFER V

US13 patents

⚠️ This page may combine multiple inventors who share the name “MUNCY JENNIFER V”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

4 patents

US7709951B2May 4, 2010

Thermal pillow

IBM27 citations92

US7917328B2Mar 29, 2011

Tracking thermal mini-cycle stress

IBM8 citations82

US7855430B2Dec 21, 2010

Electronic components on trenched substrates and method of forming same

IBM4 citations73

US7777301B2Aug 17, 2010

Electronic components on trenched substrates and method of forming same

IBM4 citations73

CASEY JON A

3 patents

US8421217B2Apr 16, 2013

Achieving mechanical and thermal stability in a multi-chip package

CASEY JON A19 citations90

US8202765B2Jun 19, 2012

Achieving mechanical and thermal stability in a multi-chip package

CASEY JON A28 citations90

US8214658B2Jul 3, 2012

Enhanced thermal management for improved module reliability

CASEY JON A4 citations61

BLANDER ALEXANDRE

2 patents

US8786059B2Jul 22, 2014

Passivation layer surface topography modifications for improved integrity in packaged assemblies

BLANDER ALEXANDRE1 citations48

US8236615B2Aug 7, 2012

Passivation layer surface topography modifications for improved integrity in packaged assemblies

BLANDER ALEXANDRE1 citations48

AFZALI-ARDAKANI ALI

1 patent

US8618036B2Dec 31, 2013

Aqueous cerium-containing solution having an extended bath lifetime for removing mask material

AFZALI-ARDAKANI ALI11 citations83

KHARMA VIJAYESHWAR D

1 patent

US8659119B2Feb 25, 2014

Electronic components on trenched substrates and method of forming same

KHARMA VIJAYESHWAR D3 citations65

COHEN ERWIN B

1 patent

US8806742B2Aug 19, 2014

Method of making an electronic package

COHEN ERWIN B3 citations57

GLOBALFOUNDRIES INC

1 patent

US9508789B2Nov 29, 2016

Electronic components on trenched substrates and method of forming same

GLOBALFOUNDRIES INC0 citations51