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Inventor
BECKER KEVIN HARRIS
US
2 patents
Patents
2 patents
US8759422B2
Jun 24, 2014
B-stageable and skip-curable wafer back side coating adhesives
HENKEL CORP
0 citations
39
US8546485B2
Oct 1, 2013
Photocurable dicing die bonding tape
HENKEL CORP
0 citations
39