Inventor

LAN CHIN KUN

TW19 patents

⚠️ This page may combine multiple inventors who share the name “LAN CHIN KUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LAN CHIN KUN

TAIWAN SEMICONDUCTOR MFG CO LTD

Sidewall spacer stack for magnetic tunnel junctions

Multi-layer structure having a dense middle layer

Multi-layer structure having a dense middle layer

Semiconductor structure having high breakdown voltage etch-stop layer

Spacer scheme and method for MRAM

Spacer stack for magnetic tunnel junctions

Semiconductor structure having high breakdown voltage etch-stop layer

Spacer scheme and method for MRAM

Methods for forming a spacer stack for magnetic tunnel junctions

High breakdown voltage inter-metal dielectric layer

Multi-layer mask and method of forming same

Spacer scheme and method for MRAM

Multi-layer mask and method of forming same

TAIWAN SEMICONDUCTOR MFG

Method to solve the delamination of a silicon nitride layer from an underlying spin on glass layer

Diffusion region routing for narrow scribe-line devices

Method for improvement of tungsten chemical-mechanical polishing process

Oxygen plasma reduction to eliminate precursor overflow in BPTEOS film deposition

Planarization of shallow trench isolation (STI)

HSIEH MING-CHANG

Diffusion region routing for narrow scribe-line devices