P

Inventor

OTSUKI TETSUYA

JP37 patents
⚠️ This page may combine multiple inventors who share the name “OTSUKI TETSUYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SEIKO EPSON CORP

31 patents
US5594282AJan 14, 1997

Resin sealing type semiconductor device and method of making the same

SEIKO EPSON CORP106 citations98
US6133623AOct 17, 2000

Resin sealing type semiconductor device that includes a plurality of leads and method of making the same

SEIKO EPSON CORP157 citations94
US5653891AAug 5, 1997

Method of producing a semiconductor device with a heat sink

SEIKO EPSON CORP48 citations94
US5652461AJul 29, 1997

Semiconductor device with a convex heat sink

SEIKO EPSON CORP74 citations94
US5891759AApr 6, 1999

Method of making a multiple heat sink resin sealing type semiconductor device

SEIKO EPSON CORP35 citations92
US5801435ASep 1, 1998

Resin sealing type semiconductor device and method of making the same

SEIKO EPSON CORP48 citations92
US5719442AFeb 17, 1998

Resin sealing type semiconductor device

SEIKO EPSON CORP38 citations92
US5693984ADec 2, 1997

Semiconductor device having a heat radiator

SEIKO EPSON CORP35 citations92
US5633529AMay 27, 1997

Resin sealing type semiconductor device and method of making the same

SEIKO EPSON CORP26 citations92
US5777380AJul 7, 1998

Resin sealing type semiconductor device having thin portions formed on the leads

SEIKO EPSON CORP33 citations86
US5686361ANov 11, 1997

Method for manufacturing a semiconductor device having a heat radiator

SEIKO EPSON CORP14 citations74
US10866260B2Dec 15, 2020

Physical quantity sensor, electronic apparatus, and vehicle

SEIKO EPSON CORP2 citations73
US10651819B2May 12, 2020

Vibrator device, oscillator, gyro sensor, electronic apparatus, and vehicle

SEIKO EPSON CORP2 citations73
US9954160B2Apr 24, 2018

Wiring board, method of manufacturing the same, element housing package, electronic device, electronic apparatus, and moving object

SEIKO EPSON CORP3 citations68
US7696082B2Apr 13, 2010

Semiconductor device manufacturing method, semiconductor device, and wiring board

SEIKO EPSON CORP3 citations63
US7413975B2Aug 19, 2008

Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment

SEIKO EPSON CORP4 citations63
US12034433B2Jul 9, 2024

Vibrator device, oscillator, gyro sensor, electronic apparatus, and vehicle

SEIKO EPSON CORP0 citations62
US11509288B2Nov 22, 2022

Vibrator device, oscillator, gyro sensor, electronic apparatus, and vehicle

SEIKO EPSON CORP0 citations62
US11262374B2Mar 1, 2022

Sensor unit, method of manufacturing sensor unit, inertial measurement device, electronic apparatus, and vehicle

SEIKO EPSON CORP1 citations62
US7189598B2Mar 13, 2007

Wiring board, method of manufacturing the same, semiconductor device, and electronic instrument

SEIKO EPSON CORP2 citations62
US11776860B2Oct 3, 2023

Method of manufacturing electronic devices with a cap and molding

SEIKO EPSON CORP0 citations52
US11688727B2Jun 27, 2023

Electronic device

SEIKO EPSON CORP0 citations52
US11659664B2May 23, 2023

Electronic device

SEIKO EPSON CORP0 citations52
US10742169B2Aug 11, 2020

Oscillator, electronic apparatus, and vehicle

SEIKO EPSON CORP0 citations52
US9474180B2Oct 18, 2016

Method of manufacturing electronic device and electronic device

SEIKO EPSON CORP0 citations52
US7541278B2Jun 2, 2009

Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment

SEIKO EPSON CORP0 citations52
US7372167B2May 13, 2008

Semiconductor device and method of manufacturing semiconductor device

SEIKO EPSON CORP1 citations52
US11376770B2Jul 5, 2022

Method of manufacturing electronic device

SEIKO EPSON CORP0 citations51
US10615747B2Apr 7, 2020

Vibrator device, oscillator, electronic device, and vehicle

SEIKO EPSON CORP0 citations51
US10340440B2Jul 2, 2019

Electronic device, method for producing electronic device, electronic apparatus, and moving object

SEIKO EPSON CORP0 citations49
US9769934B2Sep 19, 2017

Package base, package, electronic device, electronic apparatus, and moving object

SEIKO EPSON CORP0 citations48

OTSUKI TETSUYA

3 patents

MITSUBISHI ELECTRIC CORP

1 patent

NAT RES LAB OF METROLOGY

1 patent

NEC CORP

1 patent