Inventor
SIU WILLIAM M
US3 patents
Patents
3 patentsUS6664620B2Dec 16, 2003
Integrated circuit die and/or package having a variable pitch contact array for maximization of number of signal lines per routing layer
INTEL CORP16 citations90
US5483099AJan 9, 1996
Standardized power and ground design for pin grid array packages
INTEL CORP46 citations88
US7030479B2Apr 18, 2006
Integrated circuit die and/or package having a variable pitch contact array for maximization of number of signal lines per routing layer
INTEL CORP3 citations60