Inventor
ANDERSON KEVIN J
US19 patents
⚠️ This page may combine multiple inventors who share the name “ANDERSON KEVIN J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
QORVO US INC
10 patentsUS9935026B2Apr 3, 2018
Air-cavity package with dual signal-transition sides
QORVO US INC6 citations84
US11626340B2Apr 11, 2023
Integrated circuit (IC) package with embedded heat spreader in a redistribution layer (RDL)
QORVO US INC9 citations83
US10390434B2Aug 20, 2019
Laminate-based package with internal overmold
QORVO US INC3 citations71
US9991181B2Jun 5, 2018
Air-cavity package with enhanced package integration level and thermal performance
QORVO US INC2 citations71
US9974158B2May 15, 2018
Air-cavity package with two heat dissipation interfaces
QORVO US INC5 citations71
US9799637B2Oct 24, 2017
Semiconductor package with lid having lid conductive structure
QORVO US INC2 citations66
US10177064B2Jan 8, 2019
Air cavity package
QORVO US INC1 citations62
US11929300B2Mar 12, 2024
Method for packaging an integrated circuit (IC) package with embedded heat spreader in a redistribution layer (RDL)
QORVO US INC0 citations60
US10217685B2Feb 26, 2019
Air-cavity package with dual signal-transition sides
QORVO US INC0 citations52
US10217686B2Feb 26, 2019
Air-cavity package with enhanced package integration level and thermal performance
QORVO US INC0 citations50
HARNISCHFEGER CORP
2 patents(unassigned)
2 patentsTRIQUINT SEMICONDUCTOR INC
2 patentsUS9793237B2Oct 17, 2017
Hollow-cavity flip-chip package with reinforced interconnects and process for making the same
TRIQUINT SEMICONDUCTOR INC5 citations72
US9659898B1May 23, 2017
Apparatuses, systems, and methods for die attach coatings for semiconductor packages
TRIQUINT SEMICONDUCTOR INC6 citations69