Inventor
DUMKA DEEP C
US12 patents
⚠️ This page may combine multiple inventors who share the name “DUMKA DEEP C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
QORVO US INC
8 patentsUS11626340B2Apr 11, 2023
Integrated circuit (IC) package with embedded heat spreader in a redistribution layer (RDL)
QORVO US INC9 citations83
US11145547B2Oct 12, 2021
Semiconductor chip suitable for 2.5D and 3D packaging integration and methods of forming the same
QORVO US INC2 citations71
US11948838B2Apr 2, 2024
Semiconductor chip suitable for 2.5D and 3D packaging integration and methods of forming the same
QORVO US INC0 citations61
US11610814B2Mar 21, 2023
Semiconductor chip suitable for 2.5D and 3D packaging integration and methods of forming the same
QORVO US INC0 citations61
US11289377B2Mar 29, 2022
Semiconductor chip suitable for 2.5D and 3D packaging integration and methods of forming the same
QORVO US INC0 citations61
US11127665B2Sep 21, 2021
Module assembly
QORVO US INC0 citations61
US11929300B2Mar 12, 2024
Method for packaging an integrated circuit (IC) package with embedded heat spreader in a redistribution layer (RDL)
QORVO US INC0 citations60
US10403568B2Sep 3, 2019
Module assembly
QORVO US INC0 citations50
TRIQUINT SEMICONDUCTOR INC
3 patentsUS9337278B1May 10, 2016
Gallium nitride on high thermal conductivity material device and method
TRIQUINT SEMICONDUCTOR INC200 citations96
US8946894B2Feb 3, 2015
Package for high-power semiconductor devices
TRIQUINT SEMICONDUCTOR INC6 citations83
US9559034B2Jan 31, 2017
Package for high-power semiconductor devices
TRIQUINT SEMICONDUCTOR INC0 citations51