Inventor
KWON OHGUK
KR8 patents
Patents
8 patentsUS11990452B2May 21, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US11887913B2Jan 30, 2024
Integrated circuit device and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11626385B2Apr 11, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US11545512B2Jan 3, 2023
Image sensor package with underfill and image sensor module including the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11545417B2Jan 3, 2023
Integrated circuit device and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD1 citations61
US11735566B2Aug 22, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations50
US11710757B2Jul 25, 2023
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US12538803B2Jan 27, 2026
Semiconductor package including a barrier structure covering connection pads and contacting a protruding portion of an adhesive layer
SAMSUNG ELECTRONICS CO LTD0 citations47