Inventor
LI HUNG-YUAN
TW23 patents
⚠️ This page may combine multiple inventors who share the name “LI HUNG-YUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MERRY ELECTRONICS SHENZHEN CO LTD
11 patentsUS12438989B2Oct 7, 2025
Audio device and control method thereof
MERRY ELECTRONICS SHENZHEN CO LTD0 citations61
US11290801B2Mar 29, 2022
Headset charging system and headset charging method
MERRY ELECTRONICS SHENZHEN CO LTD1 citations61
US12332506B2Jun 17, 2025
Wearable device and earbud
MERRY ELECTRONICS SHENZHEN CO LTD0 citations51
US11678115B2Jun 13, 2023
Playback device and control method
MERRY ELECTRONICS SHENZHEN CO LTD0 citations51
US11387662B2Jul 12, 2022
Headset charging and data transmission system
MERRY ELECTRONICS SHENZHEN CO LTD0 citations51
US11223892B2Jan 11, 2022
Headset charging and data transmission system
MERRY ELECTRONICS SHENZHEN CO LTD0 citations51
US10104461B2Oct 16, 2018
Method, electronic apparatus and wireless earphone of choosing master wireless earphone in wireless earphone set
MERRY ELECTRONICS SHENZHEN CO LTD1 citations51
US9338548B2May 10, 2016
Mobile device and corresponding noise-canceling earphone
MERRY ELECTRONICS SHENZHEN CO LTD0 citations51
US10686322B2Jun 16, 2020
Electronic device
MERRY ELECTRONICS SHENZHEN CO LTD0 citations40
US10136202B1Nov 20, 2018
Electronic apparatus
MERRY ELECTRONICS SHENZHEN CO LTD0 citations40
US9299335B2Mar 29, 2016
Handheld electronic device and corresponding noise-canceling headphones
MERRY ELECTRONICS SHENZHEN CO LTD1 citations39
MERRY ELECTRONICS CO LTD
3 patentsUS11937200B2Mar 19, 2024
Earphone synchronization method and true wireless earphone system
MERRY ELECTRONICS CO LTD6 citations66
US11974086B2Apr 30, 2024
Earphone charging system and charging method thereof
MERRY ELECTRONICS CO LTD0 citations61
US12133040B2Oct 29, 2024
Headset charging system and headset charging method thereof
MERRY ELECTRONICS CO LTD0 citations51
SILICONWARE PRECISION INDUSTRIES CO LTD
3 patentsUS10403570B2Sep 3, 2019
Method for fabricating electronic package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations50
US10128178B2Nov 13, 2018
Electronic package and method for fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD1 citations50
US9831191B2Nov 28, 2017
Electronic package, semiconductor substrate of the electronic package, and method for manufacturing the electronic package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations50