Inventor
MARIEB THOMAS N
US5 patents
Patents
5 patentsUS6800554B2Oct 5, 2004
Copper alloys for interconnections having improved electromigration characteristics and methods of making same
INTEL CORP47 citations93
US7220674B2May 22, 2007
Copper alloys for interconnections having improved electromigration characteristics and methods of making same
INTEL CORP15 citations89
US6977220B2Dec 20, 2005
Copper alloys for interconnections having improved electromigration characteristics and methods of making same
INTEL CORP12 citations81
US6100709AAug 8, 2000
Silicon wafer testing rig and a method for testing a silicon wafer wherein the silicon wafer is bent into a dome shape
INTEL CORP13 citations71
US6777810B2Aug 17, 2004
Interconnection alloy for integrated circuits
INTEL CORP0 citations51