Inventor
KOVAC ZLATA
25 patents
⚠️ This page may combine multiple inventors who share the name “KOVAC ZLATA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TESSERA INC
22 patentsUS6030856AFeb 29, 2000
Bondable compliant pads for packaging of a semiconductor chip and method therefor
TESSERA INC127 citations99
US6012224AJan 11, 2000
Method of forming compliant microelectronic mounting device
TESSERA INC157 citations99
US5706174AJan 6, 1998
Compliant microelectrionic mounting device
TESSERA INC142 citations99
US5659952AAug 26, 1997
Method of fabricating compliant interface for semiconductor chip
TESSERA INC491 citations99
US5590460AJan 7, 1997
Method of making multilayer circuit
TESSERA INC172 citations99
US5491302AFeb 13, 1996
Microelectronic bonding with lead motion
TESSERA INC159 citations99
US5548091AAug 20, 1996
Semiconductor chip connection components with adhesives and methods for bonding to the chip
TESSERA INC151 citations98
US6870272B2Mar 22, 2005
Methods of making microelectronic assemblies including compliant interfaces
TESSERA INC55 citations96
US6723584B2Apr 20, 2004
Methods of making microelectronic assemblies including compliant interfaces
TESSERA INC39 citations96
US6525429B1Feb 25, 2003
Methods of making microelectronic assemblies including compliant interfaces
TESSERA INC69 citations96
US6373141B1Apr 16, 2002
Bondable compliant pads for packaging of a semiconductor chip and method therefor
TESSERA INC54 citations96
US6370032B1Apr 9, 2002
Compliant microelectronic mounting device
TESSERA INC38 citations96
US6274820B1Aug 14, 2001
Electrical connections with deformable contacts
TESSERA INC52 citations96
US6266874B1Jul 31, 2001
Methods of making microelectronic components having electrophoretically deposited layers
TESSERA INC62 citations96
US6239386B1May 29, 2001
Electrical connections with deformable contacts
TESSERA INC48 citations96
US6133639AOct 17, 2000
Compliant interface for semiconductor chip and method therefor
TESSERA INC66 citations96
US6255738B1Jul 3, 2001
Encapsulant for microelectronic devices
TESSERA INC127 citations95
US6202299B1Mar 20, 2001
Semiconductor chip connection components with adhesives and methods of making same
TESSERA INC46 citations95
US6045655AApr 4, 2000
Method of mounting a connection component on a semiconductor chip with adhesives
TESSERA INC66 citations95
US5875545AMar 2, 1999
Method of mounting a connection component on a semiconductor chip with adhesives
TESSERA INC63 citations95
US7368818B2May 6, 2008
Methods of making microelectronic assemblies including compliant interfaces
TESSERA INC18 citations93
US5619017AApr 8, 1997
Microelectronic bonding with lead motion
TESSERA INC37 citations92