Inventor
SAMBUCETTI CARLOS JUAN
25 patents
Patents
25 patentsUS6342733B1Jan 29, 2002
Reduced electromigration and stressed induced migration of Cu wires by surface coating
IBM506 citations98
US5775569AJul 7, 1998
Method for building interconnect structures by injection molded solder and structures built
IBM120 citations98
US5755859AMay 26, 1998
Cobalt-tin alloys and their applications for devices, chip interconnections and packaging
IBM405 citations98
US6573606B2Jun 3, 2003
Chip to wiring interface with single metal alloy layer applied to surface of copper interconnect
IBM307 citations97
US6332569B1Dec 25, 2001
Etched glass solder bump transfer for flip chip integrated circuit devices
IBM97 citations97
US6323128B1Nov 27, 2001
Method for forming Co-W-P-Au films
IBM292 citations97
US6149122ANov 21, 2000
Method for building interconnect structures by injection molded solder and structures built
IBM61 citations95
US6133633AOct 17, 2000
Method for building interconnect structures by injection molded solder and structures built
IBM40 citations95
US6105852AAug 22, 2000
Etched glass solder bump transfer for flip chip integrated circuit devices
IBM73 citations95
US6646345B2Nov 11, 2003
Method for forming Co-W-P-Au films
IBM45 citations94
US6819000B2Nov 16, 2004
High density area array solder microjoining interconnect structure and fabrication method
IBM28 citations92
US6732908B2May 11, 2004
High density raised stud microjoining system and methods of fabricating the same
IBM19 citations92
US6661098B2Dec 9, 2003
High density area array solder microjoining interconnect structure and fabrication method
IBM18 citations92
US6013713AJan 11, 2000
Electrode modification using an unzippable polymer paste
IBM18 citations92
US5897336AApr 27, 1999
Direct chip attach for low alpha emission interconnect system
IBM42 citations92
US6340630B1Jan 22, 2002
Method for making interconnect for low temperature chip attachment
IBM28 citations91
US6127735AOct 3, 2000
Interconnect for low temperature chip attachment
IBM41 citations91
US6099939AAug 8, 2000
Enhanced adhesion between a vapor deposited metal and an organic polymer surface exhibiting tailored morphology
IBM35 citations89
US4026713AMay 31, 1977
Water based magnetic inks and the manufacture thereof
IBM40 citations89
US6281105B1Aug 28, 2001
Electrode modification using an unzippable polymer paste
IBM14 citations82
US7825516B2Nov 2, 2010
Formation of aligned capped metal lines and interconnections in multilevel semiconductor structures
IBM9 citations78
US6221503B1Apr 24, 2001
Electrode modification using an unzippable polymer paste
IBM5 citations74
US4107063AAug 15, 1978
Water based selectable charge magnetic inks
IBM11 citations74
US6747472B2Jun 8, 2004
Temporary device attach structure for test and burn in of microjoint interconnects and method for fabricating the same
IBM8 citations72
US7880305B2Feb 1, 2011
Technology for fabrication of packaging interface substrate wafers with fully metallized vias through the substrate wafer
IBM0 citations42