Inventor
APPELT BERND K
US20 patents
Patents
20 patentsUS6215649B1Apr 10, 2001
Printed circuit board capacitor structure and method
IBM110 citations98
US4969979ANov 13, 1990
Direct electroplating of through holes
IBM66 citations94
US6391210B2May 21, 2002
Process for manufacturing a multi-layer circuit board
IBM17 citations93
US6207595B1Mar 27, 2001
Laminate and method of manufacture thereof
IBM59 citations93
US6815085B2Nov 9, 2004
Printed circuit board capacitor structure and method
IBM22 citations92
US6781064B1Aug 24, 2004
Printed circuit boards for electronic device packages having glass free non-conductive layers and method of forming same
IBM16 citations92
US6555762B2Apr 29, 2003
Electronic package having substrate with electrically conductive through holes filled with polymer and conductive composition
IBM38 citations92
US5977642ANov 2, 1999
Dendrite interconnect for planarization and method for producing same
IBM20 citations92
US5305186AApr 19, 1994
Power carrier with selective thermal performance
IBM48 citations92
US4479983AOct 30, 1984
Method and composition for applying coatings on printed circuit boards
IBM31 citations90
US5189261AFeb 23, 1993
Electrical and/or thermal interconnections and methods for obtaining such
IBM52 citations89
US6256874B1Jul 10, 2001
Conductor interconnect with dendrites through film and method for producing same
IBM13 citations82
US6625857B2Sep 30, 2003
Method of forming a capacitive element
IBM8 citations74
US6574090B2Jun 3, 2003
Printed circuit board capacitor structure and method
IBM9 citations74
US6427323B2Aug 6, 2002
Method for producing conductor interconnect with dendrites
IBM7 citations74
US6300575B1Oct 9, 2001
Conductor interconnect with dendrites through film
IBM5 citations74
US6290860B1Sep 18, 2001
Process for design and manufacture of fine line circuits on planarized thin film dielectrics and circuits manufactured thereby
IBM7 citations74
US6252307B1Jun 26, 2001
Structure for preventing adhesive bleed onto surfaces
IBM12 citations72
US6739046B1May 25, 2004
Method for producing dendrite interconnect for planarization
IBM3 citations63
US6420253B2Jul 16, 2002
Method for preventing adhesive bleed onto surfaces
IBM3 citations61