Inventor

LAUFFER JOHN M

US115 patents

⚠️ This page may combine multiple inventors who share the name “LAUFFER JOHN M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LAUFFER JOHN M

IBM

Printed circuit boards and cards having buried thin film capacitors and processing techniques for fabricating said boards and cards

Circuitry with integrated passive components and method for producing

Printed circuit board capacitor structure and method

Two signal one power plane circuit board

Printed circut board with embedded decoupling capacitance and method for producing same

Method for making a printed wiring board

Conductive substructures of a multilayered laminate

Composite laminate circuit structure and methods of interconnecting the same

Composite laminate circuit structure and methods of interconnecting the same

Copper etching compositions, processes and products derived therefrom

Method of making a parallel capacitor laminate

Capacitor laminate for use in printed circuit board and as an interconnector

Formation of multisegmented plated through holes

Formation of multisegmented plated through holes

Process for manufacturing a multi-layer circuit board

Multilayer capacitance structure and circuit board containing the same

Sequential build-up organic chip carrier and method of manufacture

Copper cleaning compositions, processes and products derived therefrom

Printed circuit board capacitor structure and method

Printed circuit boards for electronic device packages having glass free non-conductive layers and method of forming same

Two signal one power plane circuit board

Method for producing printed circuit board with embedded decoupling capacitance

Through hole in a photoimageable dielectric structure with wired and uncured dielectric

High performance dense wire for printed circuit board

Method for producing a circuit board with embedded decoupling capacitance

Multi-voltage plane, multi-signal plane circuit card with photoimageable dielectric

Laminate substrate having joining layer of photoimageable material

Dendrite interconnect for planarization and method for producing same

Via fill compositions for direct attach of devices and methods for applying same

Power carrier with selective thermal performance

Filling open through holes in a multilayer board

Method of reworking circuit panels, and circuit panels reworked thereby

Electrical and/or thermal interconnections and methods for obtaining such

ENDICOTT INTERCONNECT TECH INC

Circuitized substrate with internal stacked semiconductor chips, method of making same, electrical assembly utilizing same and information handling system utilizing same

High speed circuitized substrate with reduced thru-hole stub, method for fabrication and information handling system utilizing same

High speed circuit board and method for fabrication

Circuitized substrate assembly and method of making same

LED lighting assembly and lamp utilizing same

Resistor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said ciruitized substrate, and information handling system utilizing said ciruitized substrate

Capacitor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate

Circuitized substrates utilizing three smooth-sided conductive layers as part thereof, method of making same, and electrical assemblies and information handling systems utilizing same

Method of providing printed circuit board with conductive holes and board resulting therefrom

Method of making multilayered printed circuit board with filled conductive holes

Printed circuit board with low cross-talk noise

Apparatus and method for making circuitized substrates in a continuous manner

Circuitized substrate with signal wire shielding, electrical assembly utilizing same and method of making

Multi-layer embedded capacitance and resistance substrate core

Capacitor material for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate

ENDICOTT INTERCONECT TECHNOLOG

Circuitized substrate with solder-coated microparticle paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same and method of making said substrate

DAS RABINDRA N

Substrate having internal capacitor and method of making same