P

Inventor

WEGE STEPHAN

DE26 patents
⚠️ This page may combine multiple inventors who share the name “WEGE STEPHAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INFINEON TECHNOLOGIES AG

18 patents
US6479373B2Nov 12, 2002

Method of structuring layers with a polysilicon layer and an overlying metal or metal silicide layer using a three step etching process with fluorine, chlorine, bromine containing gases

INFINEON TECHNOLOGIES AG237 citations95
US6153492ANov 28, 2000

Method for improving the readability of alignment marks

INFINEON TECHNOLOGIES AG33 citations91
US6583020B2Jun 24, 2003

Method for fabricating a trench isolation for electrically active components

INFINEON TECHNOLOGIES AG13 citations82
US6511918B2Jan 28, 2003

Method of structuring a metal-containing layer

INFINEON TECHNOLOGIES AG15 citations77
US7544270B2Jun 9, 2009

Apparatus for processing a substrate

INFINEON TECHNOLOGIES AG8 citations76
US6541372B2Apr 1, 2003

Method for manufacturing a conductor structure for an integrated circuit

INFINEON TECHNOLOGIES AG10 citations73
US6919269B2Jul 19, 2005

Production method for a semiconductor component

INFINEON TECHNOLOGIES AG9 citations72
US6693022B2Feb 17, 2004

CVD method of producing in situ-doped polysilicon layers and polysilicon layered structures

INFINEON TECHNOLOGIES AG6 citations70
US7141507B2Nov 28, 2006

Method for production of a semiconductor structure

INFINEON TECHNOLOGIES AG9 citations69
US7368390B2May 6, 2008

Photolithographic patterning process using a carbon hard mask layer of diamond-like hardness produced by a plasma-enhanced deposition process

INFINEON TECHNOLOGIES AG6 citations61
US7265023B2Sep 4, 2007

Fabrication method for a semiconductor structure

INFINEON TECHNOLOGIES AG5 citations58
US6596625B2Jul 22, 2003

Method and device for producing a metal/metal contact in a multilayer metallization of an integrated circuit

INFINEON TECHNOLOGIES AG3 citations54
US6380076B2Apr 30, 2002

Dielectric filling of electrical wiring planes

INFINEON TECHNOLOGIES AG1 citations51
US7037777B2May 2, 2006

Process for producing an etching mask on a microstructure, in particular a semiconductor structure with trench capacitors, and corresponding use of the etching mask

INFINEON TECHNOLOGIES AG0 citations50
US6380074B1Apr 30, 2002

Deposition of various base layers for selective layer growth in semiconductor production

INFINEON TECHNOLOGIES AG0 citations48
US6436731B2Aug 20, 2002

Method of producing a semiconductor device comprising a cleaning process for removing silicon-containing material

INFINEON TECHNOLOGIES AG0 citations46
US7105404B2Sep 12, 2006

Method for fabricating a semiconductor structure

INFINEON TECHNOLOGIES AG0 citations41
US6821894B2Nov 23, 2004

CMP process

INFINEON TECHNOLOGIES AG0 citations40

APPLIED MATERIALS INC

2 patents

QIMONDA AG

2 patents

INFINEON TECHNOLOGIES CORP

1 patent

WEGE STEPHAN

1 patent

SILICON STORAGE TECH INC

1 patent

TOREN WILLEM-JAN

1 patent