Inventor

OKI TETSURO

JP3 patents

Patents

3 patents

US5494549AFeb 27, 1996

Dicing method

ROHM CO LTD14 citations71

US5451549ASep 19, 1995

Semiconductor dicing method which uses variable sawing speeds

ROHM CO LTD17 citations71

US5462900AOct 31, 1995

Method of manufacturing semiconductor elements without burrs

ROHM CO LTD2 citations57