Inventor

BALAKRISHNAN SRIDHAR

US23 patents

⚠️ This page may combine multiple inventors who share the name “BALAKRISHNAN SRIDHAR”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BALAKRISHNAN SRIDHAR

INTEL CORP

Designs and methods for conductive bumps

Method and an apparatus for forming an under bump metallization structure

Etchback process for tungsten utilizing a NF3/AR chemistry

Air-gap ILD with unlanded vias

Post polish anneal of atomic layer deposition barrier layers

Method of sealing a semiconductor substrate

Conformal electroless deposition of barrier layer materials

Method and an apparatus for forming an under bump metallization structure

Designs and methods for conductive bumps

Designs and methods for conductive bumps

Debond interconnect structures

Debond interconnect structures

CIENA CORP

Method and system for suppressing ASE on a WDM network

Method and system for controlling amplifier power in an optical communications network

Method and system for determining channel power in an optical communications network

Method and system for controlling amplifier power in an optical communications network having add/drop capability

Method and system for controlling amplifier power in an optical communications network having add/drop capability

DUBIN VALERY M

Designs and methods for conductive bumps

Designs and methods for conductive bumps

AKOLKAR ROHAN N

Barrier layers

YOO HUI JAE

Self-forming, self-aligned barriers for back-end interconnects and methods of making same

MA QING

Debond interconnect structures

TATA CONSULTANCY SERVICES LTD

Identifying sensor drifts and diverse varying operational conditions using variational autoencoders for continual training