Inventor

SASAOKA TATSUO

JP20 patents

⚠️ This page may combine multiple inventors who share the name “SASAOKA TATSUO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SASAOKA TATSUO

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

Bump bonding method apparatus

Bonding apparatus and bonding method

Film substrate treatment apparatus, film substrate treatment method, and film substrate transport method

Low pressure plasma processing apparatus and method

Electronic part mounting apparatus and method

Bonding method and apparatus

Bare chip mounting method and bare chip mounting system

PANASONIC IP MAN CO LTD

Encapsulated semiconductor device and method for manufacturing the same

Semiconductor device having semiconductor package in a wiring board opening

Wiring substrate and production method thereof

Electronic component

Thermoelectric conversion substrate, thermoelectric conversion module and method for producing thermoelectric conversion substrate

MINAMIO MASANORI

Encapsulated semiconductor device and method for manufacturing the same

Semiconductor device and method for manufacturing the same

Joined body having an anti-corrosion film formed around a junction portion, and a semiconductor device having the same

PANASONIC CORP

Passive component incorporating interposer

Bare chip mounted structure and mounting method

Bonding method and apparatus

SASAOKA TATSUO

Mounting structure, and method of manufacturing mounting structure

HIGASHI KAZUSHI

Joining apparatus with UV cleaning