Inventor
MIKHAIL AMANDA ELISA ENNIS
US13 patents
Patents
13 patentsUS7606033B2Oct 20, 2009
Mounting a heat sink in thermal contact with an electronic component
IBM18 citations92
US7486516B2Feb 3, 2009
Mounting a heat sink in thermal contact with an electronic component
IBM32 citations92
US7293994B2Nov 13, 2007
Method and apparatus for electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention member
IBM15 citations91
US7944698B2May 17, 2011
Mounting a heat sink in thermal contact with an electronic component
IBM9 citations84
US7472477B2Jan 6, 2009
Method for manufacturing a socket that compensates for differing coefficients of thermal expansion
IBM8 citations84
US7138896B2Nov 21, 2006
Ferrite core, and flexible assembly of ferrite cores for suppressing electromagnetic interference
IBM11 citations82
US7632127B2Dec 15, 2009
Socket and method for compensating for differing coefficients of thermal expansion
IBM6 citations73
US7303443B1Dec 4, 2007
Socket and method for compensating for differing coefficients of thermal expansion
IBM8 citations73
US7530853B2May 12, 2009
Socket and method for compensating for differing coefficients of thermal expansion
IBM2 citations62
US7765693B2Aug 3, 2010
Electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention member
IBM5 citations61
US7084344B1Aug 1, 2006
V-seal EMC gasket assembly for precise placement, conduction and retention without adhesives
IBM4 citations61
US8007291B1Aug 30, 2011
Implementing differential signal circuit board electrical contact
IBM0 citations52
US7489224B2Feb 10, 2009
Ferrite core, and flexible assembly of ferrite cores for suppressing electromagnetic interference
IBM0 citations44