Inventor
PLUCINSKI MARK DAVID
US3 patents
Patents
3 patentsUS7293994B2Nov 13, 2007
Method and apparatus for electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention member
IBM15 citations91
US7497713B1Mar 3, 2009
Automatically adjustable connector to accommodate circuit board of varying thickness
IBM11 citations82
US7765693B2Aug 3, 2010
Electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention member
IBM5 citations61