Inventor
TSAI YU-FANG
TW19 patents
⚠️ This page may combine multiple inventors who share the name “TSAI YU-FANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED SEMICONDUCTOR ENG
16 patentsUS7026709B2Apr 11, 2006
Stacked chip-packaging structure
ADVANCED SEMICONDUCTOR ENG98 citations96
US7129583B2Oct 31, 2006
Multi-chip package structure
ADVANCED SEMICONDUCTOR ENG22 citations92
US6564449B1May 20, 2003
Method of making wire connection in semiconductor device
ADVANCED SEMICONDUCTOR ENG50 citations92
US6161753ADec 19, 2000
Method of making a low-profile wire connection for stacked dies
ADVANCED SEMICONDUCTOR ENG28 citations92
US6244499B1Jun 12, 2001
Structure of a ball bump for wire bonding and the formation thereof
ADVANCED SEMICONDUCTOR ENG24 citations88
US7291926B2Nov 6, 2007
Multi-chip package structure
ADVANCED SEMICONDUCTOR ENG10 citations84
US6176416B1Jan 23, 2001
Method of making low-profile wire connection
ADVANCED SEMICONDUCTOR ENG17 citations84
US7253529B2Aug 7, 2007
Multi-chip package structure
ADVANCED SEMICONDUCTOR ENG7 citations74
US6176417B1Jan 23, 2001
Ball bonding method on a chip
ADVANCED SEMICONDUCTOR ENG14 citations73
US12009353B2Jun 11, 2024
Optical device package with compatible lid and carrier
ADVANCED SEMICONDUCTOR ENG0 citations62
US11302682B2Apr 12, 2022
Optical device package
ADVANCED SEMICONDUCTOR ENG0 citations62
US7015065B2Mar 21, 2006
Manufacturing method of ball grid array package
ADVANCED SEMICONDUCTOR ENG2 citations61
US6195258B1Feb 27, 2001
Thermal board used for bonding wires in semiconductor manufacturing process
ADVANCED SEMICONDUCTOR ENG3 citations61
US9059379B2Jun 16, 2015
Light-emitting semiconductor packages and related methods
ADVANCED SEMICONDUCTOR ENG3 citations60
US7037750B2May 2, 2006
Method for manufacturing a package
ADVANCED SEMICONDUCTOR ENG6 citations60
US8994156B2Mar 31, 2015
Semiconductor device packages with solder joint enhancement elements
ADVANCED SEMICONDUCTOR ENG0 citations50