Inventor

TSAI TSUNG YUEH

TW40 patents

⚠️ This page may combine multiple inventors who share the name “TSAI TSUNG YUEH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TSAI TSUNG YUEH

ADVANCED SEMICONDUCTOR ENG

Stacked chip-packaging structure

Semiconductor package and method for processing and bonding a wire

Optical device and method of manufacturing the same

Semiconductor device package and method for manufacturing the same

Semiconductor device package and method for manufacturing the same

Semiconductor device package and method for manufacturing the same

Light emitting package and LED bulb

Package structure compatible with cooling system

Optical device and method of manufacturing the same

Fan-out ball grid array package structure and process for manufacturing the same

Optical device package with compatible lid and carrier

Optical device and electronic device

Optical device package

Bonding strength measuring device

Semiconductor device package and method for manufacturing the same

Package structure compatible with cooling system

Manufacturing method of ball grid array package

Method for manufacturing a package

Tenon-and-mortise packaging structure

Semiconductor package device and method of manufacturing the same

Semiconductor package device and method of manufacturing the same

Chip structure and stacked chip package as well as method for manufacturing chip structures

Semiconductor package device

Semiconductor package

Semiconductor package, method for enhancing the bond of a bonding wire, and method for manufacturing a semiconductor package

ASIA OPTICAL CO INC

Method of fabricating a wavelength division multiplexed (WDM) unit

Fiber container and associated optical communication device

Laser distance measuring apparatus and control method thereof

Laser distance-measuring apparatus and control methods thereof

Reliable optical add/drop device

CHANG HSIAO-CHUAN

Semiconductor device package having a buffer structure and method of fabricating the same

Semiconductor package

Semiconductor device package having a jumper chip and method of fabricating the same

LAI YI-SHAO

Semiconductor package and method for making the same

Semiconductor package having proximity communication signal input terminals and manufacturing methods thereof

Apparatus and method for testing non-contact pads of a semiconductor device to be tested

CHEN CHIEN-WEN

Advanced quad flat no lead chip package having a protective layer to enhance surface mounting and manufacturing methods thereof

CHANG HSIAO CHUAN

Wafer and semiconductor package

CHENG MING-HSIANG

Semiconductor device package

HUNG CHANG YING

Semiconductor package and method for packaging a semiconductor package