Inventor

AU HINMENG

US9 patents

⚠️ This page may combine multiple inventors who share the name “AU HINMENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

7 patents

US10763216B2Sep 1, 2020

BRAUNISCH HENNING

1 patent

US8227904B2Jul 24, 2012

Multi-chip package and method of providing die-to-die interconnects in same

BRAUNISCH HENNING174 citations98

MOHAMMED EDRIS M

1 patent

US8532449B2Sep 10, 2013

Wafer integrated optical sub-modules

MOHAMMED EDRIS M7 citations80

AU HINMENG

INTEL CORP

Multi-chip package and method of providing die-to-die interconnects in same

Multi-chip package and method of providing die-to-die interconnects in same

Multi-chip package and method of providing die-to-die interconnects in same

Multi-chip package and method of providing die-to-die interconnects in same

Multi-chip package and method of providing die-to-die interconnects in same

Multi-chip package and method of providing die-to-die interconnects in same

Method to form lateral pad on edge of wafer

BRAUNISCH HENNING

Multi-chip package and method of providing die-to-die interconnects in same

MOHAMMED EDRIS M

Wafer integrated optical sub-modules