Inventor
YAMASAKI TOMOO
JP29 patents
⚠️ This page may combine multiple inventors who share the name “YAMASAKI TOMOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHINKO ELECTRIC IND CO
21 patentsUS7531011B2May 12, 2009
Method of manufacturing capacitor device
SHINKO ELECTRIC IND CO68 citations98
US7536780B2May 26, 2009
Method of manufacturing wiring substrate to which semiconductor chip is mounted
SHINKO ELECTRIC IND CO30 citations92
US7223652B2May 29, 2007
Capacitor and manufacturing method thereof, semiconductor device and substrate for a semiconductor device
SHINKO ELECTRIC IND CO19 citations92
US7078269B2Jul 18, 2006
Substrate fabrication method and substrate
SHINKO ELECTRIC IND CO33 citations92
US6897544B2May 24, 2005
Capacitor and manufacturing method thereof, semiconductor device and substrate for a semiconductor device
SHINKO ELECTRIC IND CO38 citations92
US7352060B2Apr 1, 2008
Multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring substrate
SHINKO ELECTRIC IND CO13 citations84
US6979854B2Dec 27, 2005
Thin-film capacitor device, mounting module for the same, and method for fabricating the same
SHINKO ELECTRIC IND CO13 citations84
US7161242B2Jan 9, 2007
Semiconductor device, semiconductor device substrate, and manufacturing method thereof that can increase reliability in mounting a semiconductor element
SHINKO ELECTRIC IND CO10 citations83
US7403370B2Jul 22, 2008
Capacitor parts
SHINKO ELECTRIC IND CO8 citations74
US7375022B2May 20, 2008
Method of manufacturing wiring board
SHINKO ELECTRIC IND CO8 citations74
US7079371B2Jul 18, 2006
Capacitor device, electronic parts packaging structure, and method of manufacturing the capacitor device
SHINKO ELECTRIC IND CO9 citations74
US6999299B2Feb 14, 2006
Capacitor structure, a multi-layer wiring board including the same, and a semiconductor device using the multi-layer wiring board
SHINKO ELECTRIC IND CO10 citations74
US7072168B2Jul 4, 2006
Capacitor device and method of manufacturing the same
SHINKO ELECTRIC IND CO10 citations73
US7284307B2Oct 23, 2007
Method for manufacturing wiring board
SHINKO ELECTRIC IND CO6 citations63
US7115931B2Oct 3, 2006
Capacitor element, manufacturing method therefor, semiconductor device substrate, and semiconductor device
SHINKO ELECTRIC IND CO3 citations63
US11462501B2Oct 4, 2022
Interconnect substrate and method of making the same
SHINKO ELECTRIC IND CO0 citations62
US9780032B2Oct 3, 2017
Wiring substrate
SHINKO ELECTRIC IND CO0 citations52
US7341919B2Mar 11, 2008
Capacitor element, manufacturing method therefor, semiconductor device substrate, and semiconductor device
SHINKO ELECTRIC IND CO0 citations52
US7282419B2Oct 16, 2007
Thin-film capacitor device, mounting module for the same, and method for fabricating the same
SHINKO ELECTRIC IND CO0 citations52
US7038904B2May 2, 2006
Capacitor and method of producing same
SHINKO ELECTRIC IND CO1 citations52
US10261110B2Apr 16, 2019
Probe guide plate having a silicon oxide layer formed on surfaces and on an inner wall of a through hole thereof, and a protective insulating layer formed on the silicon oxide layer, and probe apparatus including the probe guide plate
SHINKO ELECTRIC IND CO0 citations40
HORIUCHI MICHIO
4 patentsUS8138609B2Mar 20, 2012
Semiconductor device and method of manufacturing semiconductor device
HORIUCHI MICHIO16 citations83
US9006586B2Apr 14, 2015
Wiring substrate, its manufacturing method, and semiconductor device
HORIUCHI MICHIO2 citations62
US8242612B2Aug 14, 2012
Wiring board having piercing linear conductors and semiconductor device using the same
HORIUCHI MICHIO3 citations61
US8638542B2Jan 28, 2014
Capacitor containing a large number of filamentous conductors and method of manufacturing the same
HORIUCHI MICHIO0 citations40