P

Inventor

HWANG JENNIE S

US10 patents
⚠️ This page may combine multiple inventors who share the name “HWANG JENNIE S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SCM CORP

4 patents
US4619715AOct 28, 1986

Fusible powdered metal paste

SCM CORP53 citations95
US4541876ASep 17, 1985

Nonaqueous powdered metal paste composition

SCM CORP41 citations92
US4460414AJul 17, 1984

Solder paste and vehicle therefor

SCM CORP37 citations92
US4557767ADec 10, 1985

Fusible powdered metal paste

SCM CORP16 citations73

TECHNOLOGIES GROUP INC H

2 patents
US5985212ANov 16, 1999

High strength lead-free solder materials

TECHNOLOGIES GROUP INC H59 citations94
US6176947B1Jan 23, 2001

Lead-free solders

TECHNOLOGIES GROUP INC H100 citations92

US ARMY

1 patent
US5520752AMay 28, 1996

Composite solders

US ARMY121 citations93

ANTAYA TECH CORPORATION

1 patent
US10105794B2Oct 23, 2018

Method of forming a lead-free solder composition

ANTAYA TECH CORPORATION3 citations69

ANTAYA TECH CORP

1 patent
US9975207B2May 22, 2018

Lead-free solder composition

ANTAYA TECH CORP3 citations68

HWANG JENNIE S

1 patent
US8771592B2Jul 8, 2014

Lead-free solder composition

HWANG JENNIE S3 citations54