Inventor

TSAI WEI-KUNG

TW17 patents

⚠️ This page may combine multiple inventors who share the name “TSAI WEI-KUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TSAI WEI-KUNG

TAIWAN SEMICONDUCTOR MFG CO LTD

Trap layer substrate stacking technique to improve performance for RF devices

Substrate fabrication method to improve RF (radio frequency) device performance

Integrated circuit and manufacturing method thereof

SOI substrate

Trap layer substrate stacking technique to improve performance for RF devices

Trap layer substrate stacking technique to improve performance for RF devices

Process to form SOI substrate

Mechanisms for forming semiconductor device structure with floating spacer

Integrated circuit

Mechanisms for forming radio frequency (RF) area of integrated circuit structure

Mechanisms for forming radio frequency (RF) area of integrated circuit structure

Semiconductor device structure with metal ring on silicon-on-insulator (SOI) substrate

Semiconductor device structure having carrier-trapping layers with different grain sizes

Semiconductor device and method for forming the same

TAIWAN SEMICONDUCTOR MFG

Method for forming dual damascenes

Integrated circuit using deep trench through silicon (DTS)

Integrated circuit using deep trench through silicon (DTS)