Inventor

FIGUEROA DAVID G

US53 patents

⚠️ This page may combine multiple inventors who share the name “FIGUEROA DAVID G”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FIGUEROA DAVID G

INTEL CORP

Electronic assembly with trench structures and methods of manufacture

Hybrid capacitor and method of fabrication therefor

Embedded capacitor assembly in a package

Inductive filters and methods of fabrication therefor

Electronic assembly comprising ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture

Multiple tier array capacitor

Interconnected series of plated through hole vias and method of fabrication therefor

Electronic package having embedded capacitors and method of fabrication therefor

Dual-socket interposer and method of fabrication therefor

Discrete device socket and method of fabrication therefor

Shunt power connection for an integrated circuit package

Universal capacitor terminal design

Data processing system comprising ceramic/organic hybrid substrate with embedded capacitors

Hybrid capacitor, circuit, and system

Method of fabrication for a socket with embedded conductive structure

Embedded enclosure for effective electromagnetic radiation reduction

Vertical electronic circuit package

Electronic circuit housing with trench vias and method of fabrication therefor

Integral capacitor using embedded enclosure for effective electromagnetic radiation reduction

Electronic assembly providing shunting of electrical current

Integrated circuit packages with sandwiched capacitors

Electronic assembly with sandwiched capacitors and methods of manufacture

Capacitor with extended surface lands and method of fabrication therefor

Dual-socket interposer and method of fabrication therefor

Electronic assemblies comprising ceramic/organic hybrid substrate with embedded capacitors

Substrates and systems to minimize signal path discontinuities

Inductive filters and methods of fabrication thereof

Pad and via placement design for land side capacitors

Circuit board with trace configuration for high-speed digital differential signaling

Circuit board with trace configuration for high-speed digital differential signaling

Integrated circuit socket with capacitors and shunts

Electrical assembly with vertical multiple layer structure

Fabrication method for vertical electronic circuit package and system

Capacitor design for controlling equivalent series resistance

Integrated circuit package with a capacitor

Socket with embedded conductive structure and method of fabrication therefor

Capacitors having separate terminals on three or more sides

Circuit board with trace configuration for high-speed digital differential signaling

Coaxial dual pin sockets for high speed I/O applications

Low impedance, high-power socket and method of using

Coaxial dual pin sockets for high speed I/O applications

Socket with low inductance side contacts for a microelectronic device package

System to control effective series resistance of decoupling capacitor

High ESR low ESL capacitor

Power/ground configuration for low impedance integrated circuit

Power plane to reduce voltage difference between connector power pins

Capacitor-related systems for addressing package/motherboard resonance

Noise reduction method by implementing certain port-to-port delay

MURATA MANUFACTURING CO

Multilayer capacitor, wiring board, decoupling circuit, and high frequency circuit incorporating the same

VENKATARAMAN SRIKRISHNAN

Method to control delay between lanes