Inventor

LIFF SHAWNA

US47 patents

⚠️ This page may combine multiple inventors who share the name “LIFF SHAWNA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIFF SHAWNA

INTEL CORP

Reconstituted wafer assembly

Composite interposer structure and method of providing same

Composite IC chips including a chiplet embedded within metallization layers of a host IC chip

Heat spreading layer integrated within a composite IC die structure and methods of forming the same

Method of fabricating a stretchable computing device

Mixed hybrid bonding structures and methods of forming the same

High-density interconnects for integrated circuit packages

Mixed hybrid bonding structures and methods of forming the same

Superconducting qubit device packages

Waveguide connector having a curved array of waveguides configured to connect a package to excitation elements

Waveguide coupling systems and methods

Microelectronic package communication using radio interfaces connected through wiring

Electronic device package

Wavy interconnect for bendable and stretchable devices

Heterogeneous nested interposer package for IC chips

Heterogeneous nested interposer package for IC chips

Interposer package-on-package (PoP) with solder array thermal contacts

Selective recess of interconnects for probing hybrid bond devices

Organic interposers for integrated circuit packages

Vias in composite IC chip structures

5G mmWave cooling through PCB

Integrated circuit and method that utilize a shape memory material

Waveguide interconnects for semiconductor packages and related methods

Liquid cooled interposer for integrated circuit stack

Microelectronic package communication using radio interfaces connected through wiring

Selective interconnects in back-end-of-line metallization stacks of integrated circuitry

Composite interposer structure and method of providing same

Thermal performance in hybrid bonded 3D die stacks

High-density interconnects for integrated circuit packages

Composite interposer structure and method of providing same

Composite IC chips including a chiplet embedded within metallization layers of a host IC chip

Interconnection structure fabrication using grayscale lithography

Heat spreading layer integrated within a composite IC die structure and methods of forming the same

Interconnection structure fabrication using grayscale lithography

Packaged device with a chiplet comprising memory resources

Skip level vias in metallization layers for integrated circuit devices

Skip level vias in metallization layers for integrated circuit devices

Heterogeneous nested interposer package for IC chips

Heterogeneous nested interposer package for IC chips

Vias in composite IC chip structures

Aligned core balls for interconnect joint stability

Device, method and system to mitigate stress on hybrid bonds in a multi-tier arrangement of chiplets

Semiconductor package including a modular side radiating waveguide launcher

Non-rectangular electronic device components

Dual sided thermal management solutions for integrated circuit packages

Flexible electronic assembly method

LIFF SHAWNA

Two-dimensional, high-density optical connector