Inventor
KIM GAYOUNG
KR23 patents
⚠️ This page may combine multiple inventors who share the name “KIM GAYOUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG DISPLAY CO LTD
12 patentsUS12039138B1Jul 16, 2024
Input sensing unit and display device including the same
SAMSUNG DISPLAY CO LTD2 citations71
US11003266B2May 11, 2021
Display device
SAMSUNG DISPLAY CO LTD5 citations69
US12321557B2Jun 3, 2025
Input sensing part and display device including the same
SAMSUNG DISPLAY CO LTD1 citations62
US11846966B2Dec 19, 2023
Electronic device
SAMSUNG DISPLAY CO LTD1 citations62
US11809668B2Nov 7, 2023
Electronic device having a sensing electrode including a trunk portion and a branch portion
SAMSUNG DISPLAY CO LTD1 citations62
US12578829B2Mar 17, 2026
Input sensing unit having improved sensing sensitivity and display device including the same
SAMSUNG DISPLAY CO LTD0 citations61
US12373071B2Jul 29, 2025
Electronic device including sensor layer for sensing inputs by touch and pen
SAMSUNG DISPLAY CO LTD0 citations61
US10852886B2Dec 1, 2020
Input sensing unit and electronic device including the same
SAMSUNG DISPLAY CO LTD1 citations59
US11579725B2Feb 14, 2023
Electronic device
SAMSUNG DISPLAY CO LTD0 citations52
US12524121B2Jan 13, 2026
Electronic device
SAMSUNG DISPLAY CO LTD0 citations51
US12386467B2Aug 12, 2025
Electronic device configured to sense a pen
SAMSUNG DISPLAY CO LTD0 citations51
US11714514B2Aug 1, 2023
Electronic device
SAMSUNG DISPLAY CO LTD0 citations51
SAMSUNG ELECTRONICS CO LTD
7 patentsUS11769743B2Sep 26, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations70
US11967578B2Apr 23, 2024
Semiconductor package including post
SAMSUNG ELECTRONICS CO LTD2 citations69
US11177199B2Nov 16, 2021
Semiconductor packages with external bump pads having trench portions and semiconductor modules including the semiconductor packages
SAMSUNG ELECTRONICS CO LTD0 citations61
US12237285B2Feb 25, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations60
US12322720B2Jun 3, 2025
Semiconductor package including post
SAMSUNG ELECTRONICS CO LTD0 citations59
US11756869B2Sep 12, 2023
Semiconductor package having UBM pad with gap separating central portion from peripheral portion
SAMSUNG ELECTRONICS CO LTD0 citations58
US11276633B2Mar 15, 2022
Semiconductor package having UBM pad with gap separating central portion from peripheral portion
SAMSUNG ELECTRONICS CO LTD0 citations58