Inventor
BABU SURYADEVARA V
US27 patents
⚠️ This page may combine multiple inventors who share the name “BABU SURYADEVARA V”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
EASTMAN KODAK CO
8 patentsUS6544892B2Apr 8, 2003
Slurry for chemical mechanical polishing silicon dioxide
EASTMAN KODAK CO88 citations97
US6491843B1Dec 10, 2002
Slurry for chemical mechanical polishing silicon dioxide
EASTMAN KODAK CO92 citations97
US6918820B2Jul 19, 2005
Polishing compositions comprising polymeric cores having inorganic surface particles and method of use
EASTMAN KODAK CO19 citations93
US6627107B2Sep 30, 2003
Slurry for chemical mechanical polishing silicon dioxide
EASTMAN KODAK CO23 citations92
US5674621AOct 7, 1997
Fuser members with an outermost layer of a fluorinated diamond like carbon
EASTMAN KODAK CO35 citations91
US6007954ADec 28, 1999
Electrophotographic apparatus with improved blue sensitivity
EASTMAN KODAK CO16 citations73
US5849443ADec 15, 1998
Method of making multilayer electrophotographic elements
EASTMAN KODAK CO15 citations73
US5849445ADec 15, 1998
Multilayer photoconductive elements having low dark decay
EASTMAN KODAK CO12 citations73
IBM
8 patentsUS4956197ASep 11, 1990
Plasma conditioning of a substrate for electroless plating
IBM23 citations92
US5061359AOct 29, 1991
Plasma processing apparatus including three bus structures
IBM26 citations91
US4599134AJul 8, 1986
Plasma etching with tracer
IBM23 citations81
US4718972AJan 12, 1988
Method of removing seed particles from circuit board substrate surface
IBM21 citations78
US4735820AApr 5, 1988
Removal of residual catalyst from a dielectric substrate
IBM10 citations72
US4618477AOct 21, 1986
Uniform plasma for drill smear removal reactor
IBM16 citations72
US4810326AMar 7, 1989
Interlaminate adhesion between polymeric materials and electrolytic copper surfaces
IBM18 citations71
US5053104AOct 1, 1991
Method of plasma etching a substrate with a gaseous organohalide compound
IBM6 citations60
UNIV CLARKSON
3 patentsUS7091164B2Aug 15, 2006
Slurry for chemical mechanical polishing silicon dioxide
UNIV CLARKSON22 citations92
US7723234B2May 25, 2010
Method for selective CMP of polysilicon
UNIV CLARKSON6 citations57
US7629258B2Dec 8, 2009
Method for one-to-one polishing of silicon nitride and silicon oxide
UNIV CLARKSON0 citations48