Inventor
RIVERA ISAAC
US3 patents
Patents
3 patentsUS11756848B1Sep 12, 2023
Chip integration into cavities of a host wafer using lateral dielectric material bonding
PSEUDOLITHIC INC3 citations67
US12261091B2Mar 25, 2025
Chip integration into cavities of a host wafer using lateral dielectric material bonding
PSEUDOLITHIC INC0 citations56
US12125759B2Oct 22, 2024
Chip integration into cavities of a host wafer using lateral dielectric material bonding
PSEUDOLITHIC INC0 citations56