Inventor
HAKAMATA Takahiro
US8 patents
Patents
8 patentsUS10361366B2Jul 23, 2019
Resistive random accress memory containing a conformal titanium aluminum carbide film and method of making
TOKYO ELECTRON LTD324 citations96
US10378105B2Aug 13, 2019
Selective deposition with surface treatment
TOKYO ELECTRON LTD12 citations83
US11024535B2Jun 1, 2021
Method for filling recessed features in semiconductor devices with a low-resistivity metal
TOKYO ELECTRON LTD4 citations71
US12284820B2Apr 22, 2025
Dual metal wrap-around contacts for semiconductor devices
TOKYO ELECTRON LTD0 citations62
US11374101B2Jun 28, 2022
Dual metal wrap-around contacts for semiconductor devices
TOKYO ELECTRON LTD0 citations62
US11621190B2Apr 4, 2023
Method for filling recessed features in semiconductor devices with a low-resistivity metal
TOKYO ELECTRON LTD0 citations61
US10056328B2Aug 21, 2018
Ruthenium metal feature fill for interconnects
TOKYO ELECTRON LTD1 citations51
US9711449B2Jul 18, 2017
Ruthenium metal feature fill for interconnects
TOKYO ELECTRON LTD1 citations51