Inventor
UMEMOTO MITSUO
JP35 patents
⚠️ This page may combine multiple inventors who share the name “UMEMOTO MITSUO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SANYO ELECTRIC CO
14 patentsUS7339273B2Mar 4, 2008
Semiconductor device with a via hole having a diameter at the surface larger than a width of a pad electrode
SANYO ELECTRIC CO46 citations96
US7646079B2Jan 12, 2010
Semiconductor device, method of manufacturing the same, circuit board, and method of manufacturing the same
SANYO ELECTRIC CO28 citations92
US7646100B2Jan 12, 2010
Semiconductor device with penetrating electrode
SANYO ELECTRIC CO22 citations92
US7582971B2Sep 1, 2009
Semiconductor device and manufacturing method of the same
SANYO ELECTRIC CO40 citations92
US7485967B2Feb 3, 2009
Semiconductor device with via hole for electric connection
SANYO ELECTRIC CO20 citations92
US7732925B2Jun 8, 2010
Semiconductor device and manufacturing method thereof
SANYO ELECTRIC CO14 citations84
US7670955B2Mar 2, 2010
Semiconductor device and manufacturing method of the same
SANYO ELECTRIC CO12 citations84
US7227262B2Jun 5, 2007
Manufacturing method for semiconductor device and semiconductor device
SANYO ELECTRIC CO13 citations84
US7397128B2Jul 8, 2008
Semiconductor device and method of manufacturing the same
SANYO ELECTRIC CO11 citations79
US7906430B2Mar 15, 2011
Method of manufacturing a semiconductor device with a peeling prevention layer
SANYO ELECTRIC CO6 citations74
US7495881B2Feb 24, 2009
Chucking method and processing method using the same
SANYO ELECTRIC CO2 citations63
US7382037B2Jun 3, 2008
Semiconductor device with a peeling prevention layer
SANYO ELECTRIC CO3 citations63
US7750478B2Jul 6, 2010
Semiconductor device with via hole of uneven width
SANYO ELECTRIC CO4 citations62
US7306972B2Dec 11, 2007
Semiconductor device and manufacturing method of the same
SANYO ELECTRIC CO1 citations52
ROHM CO LTD
4 patentsUS7235428B2Jun 26, 2007
Semiconductor device production method
ROHM CO LTD11 citations84
US7638421B2Dec 29, 2009
Manufacturing method for semiconductor device and semiconductor device
ROHM CO LTD6 citations74
US7061107B2Jun 13, 2006
Semiconductor device and manufacturing method of the same
ROHM CO LTD0 citations52
US7169639B2Jan 30, 2007
Semiconductor device manufacturing method
ROHM CO LTD0 citations42
SAMSUNG ELECTRONICS CO LTD
3 patentsUS9589842B2Mar 7, 2017
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD5 citations71
US8004848B2Aug 23, 2011
Stack module, card including the stack module, and system including the stack module
SAMSUNG ELECTRONICS CO LTD3 citations63
US10105102B2Oct 23, 2018
Package for processing sensed-data, sensed-data processor, and system for processing sensed-data
SAMSUNG ELECTRONICS CO LTD1 citations51
TANIDA KAZUMASA
3 patentsUS8552545B2Oct 8, 2013
Manufacturing method for semiconductor device, semiconductor device and semiconductor chip
TANIDA KAZUMASA3 citations62
US8089163B2Jan 3, 2012
Semiconductor device production method and semiconductor device
TANIDA KAZUMASA2 citations62
US8404586B2Mar 26, 2013
Manufacturing method for semiconductor device
TANIDA KAZUMASA0 citations52