Inventor
TAKAHASHI HISATO
JP14 patents
⚠️ This page may combine multiple inventors who share the name “TAKAHASHI HISATO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI CHEMICAL CO LTD
5 patentsUS11186742B2Nov 30, 2021
Sealing resin composition, electronic component device, and method of manufacturing electronic component device
HITACHI CHEMICAL CO LTD0 citations58
US12454612B2Oct 28, 2025
Liquid resin composition for compression molding and electronic component apparatus
HITACHI CHEMICAL CO LTD0 citations47
US12131970B2Oct 29, 2024
Liquid resin composition for sealing and electronic component apparatus
HITACHI CHEMICAL CO LTD0 citations47
US12269943B2Apr 8, 2025
Liquid resin composition for sealing and electronic component device
HITACHI CHEMICAL CO LTD0 citations41
US11059966B2Jul 13, 2021
Liquid epoxy resin composition for sealing, and electronic component device
HITACHI CHEMICAL CO LTD0 citations39
SHOWA DENKO MATERIALS CO LTD
3 patentsUS11926764B2Mar 12, 2024
Polishing solution, polishing solution set, polishing method, and defect suppressing method
SHOWA DENKO MATERIALS CO LTD0 citations61
US11873414B2Jan 16, 2024
Sealing resin composition, electronic component device, and method of manufacturing electronic component device
SHOWA DENKO MATERIALS CO LTD0 citations58
US11999875B2Jun 4, 2024
Polishing solution and polishing method
SHOWA DENKO MATERIALS CO LTD0 citations57