Inventor
IMAFUJI KEI
JP14 patents
Patents
14 patentsUS7093356B2Aug 22, 2006
Method for producing wiring substrate
SHINKO ELECTRIC IND CO38 citations89
US9485864B2Nov 1, 2016
Bump structure, wiring substrate, semiconductor apparatus and bump structure manufacturing method
SHINKO ELECTRIC IND CO10 citations82
US9935043B1Apr 3, 2018
Interconnection substrate and semiconductor package
SHINKO ELECTRIC IND CO3 citations72
US9899304B2Feb 20, 2018
Wiring substrate and semiconductor device
SHINKO ELECTRIC IND CO2 citations71
US7901997B2Mar 8, 2011
Method of manufacturing semiconductor device
SHINKO ELECTRIC IND CO2 citations62
US10438883B2Oct 8, 2019
Wiring board and semiconductor device
SHINKO ELECTRIC IND CO1 citations61
US7264848B2Sep 4, 2007
Non-cyanide electroless gold plating solution and process for electroless gold plating
SHINKO ELECTRIC IND CO2 citations60
US7261803B2Aug 28, 2007
Non-cyanogen type electrolytic solution for plating gold
SHINKO ELECTRIC IND CO2 citations57
US12057384B2Aug 6, 2024
Wiring substrate and semiconductor device
SHINKO ELECTRIC IND CO0 citations50
US11605585B2Mar 14, 2023
Flexible substrate and semiconductor apparatus
SHINKO ELECTRIC IND CO0 citations50
US9210807B2Dec 8, 2015
Wiring substrate
SHINKO ELECTRIC IND CO1 citations48
US7807560B2Oct 5, 2010
Solder bump forming method
SHINKO ELECTRIC IND CO0 citations47
US9084339B2Jul 14, 2015
Wiring substrate and method of manufacturing the same
SHINKO ELECTRIC IND CO0 citations40
US9545016B2Jan 10, 2017
Wiring substrate and method for manufacturing wiring substrate
SHINKO ELECTRIC IND CO0 citations36