Inventor
GLASSMAN TIMOTHY E
US16 patents
⚠️ This page may combine multiple inventors who share the name “GLASSMAN TIMOTHY E”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED TECH MATERIALS
8 patentsUS6110529AAug 29, 2000
Method of forming metal films on a substrate by chemical vapor deposition
ADVANCED TECH MATERIALS276 citations98
US5820664AOct 13, 1998
Precursor compositions for chemical vapor deposition, and ligand exchange resistant metal-organic precursor solutions comprising same
ADVANCED TECH MATERIALS266 citations98
US5679815AOct 21, 1997
Tantalum and niobium reagents useful in chemical vapor deposition processes, and process for depositing coatings using the same
ADVANCED TECH MATERIALS49 citations96
US5677002AOct 14, 1997
Chemical vapor deposition of tantalum- or niobium-containing coatings
ADVANCED TECH MATERIALS49 citations96
US7323581B1Jan 29, 2008
Source reagent compositions and method for forming metal films on a substrate by chemical vapor deposition
ADVANCED TECH MATERIALS56 citations95
US5698022ADec 16, 1997
Lanthanide/phosphorus precursor compositions for MOCVD of lanthanide/phosphorus oxide films
ADVANCED TECH MATERIALS127 citations95
US5902639AMay 11, 1999
Method of forming bismuth-containing films by using bismuth amide compounds
ADVANCED TECH MATERIALS33 citations92
US5972743AOct 26, 1999
Precursor compositions for ion implantation of antimony and ion implantation process utilizing same
ADVANCED TECH MATERIALS8 citations74
INTEL CORP
5 patentsUS6716707B1Apr 6, 2004
Method for making a semiconductor device having a high-k gate dielectric
INTEL CORP52 citations96
US6713358B1Mar 30, 2004
Method for making a semiconductor device having a high-k gate dielectric
INTEL CORP77 citations95
US6787440B2Sep 7, 2004
Method for making a semiconductor device having an ultra-thin high-k gate dielectric
INTEL CORP41 citations92
US11342499B2May 24, 2022
RRAM devices with reduced forming voltage
INTEL CORP4 citations68
US11489112B2Nov 1, 2022
Resistive random access memory device and methods of fabrication
INTEL CORP0 citations43