Inventor
ICHIDA AKIRA
JP8 patents
⚠️ This page may combine multiple inventors who share the name “ICHIDA AKIRA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOKYO TUNGSTEN KK
5 patentsUS5493153AFeb 20, 1996
Plastic-packaged semiconductor device having a heat sink matched with a plastic package
TOKYO TUNGSTEN KK59 citations95
US6475429B2Nov 5, 2002
Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the same
TOKYO TUNGSTEN KK19 citations91
US6271585B1Aug 7, 2001
Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the same
TOKYO TUNGSTEN KK32 citations91
US6693353B1Feb 17, 2004
Semiconductor package and method for producing heat-radiating substrate for it
TOKYO TUNGSTEN KK13 citations82
US6926861B2Aug 9, 2005
Semiconductor package and method for producing heat-radiating substrate for it
TOKYO TUNGSTEN KK6 citations71