Inventor
ISHIDA KENZO
US14 patents
⚠️ This page may combine multiple inventors who share the name “ISHIDA KENZO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
8 patentsUS6020561AFeb 1, 2000
Printed circuit substrate with solder formed on pad-on-via and pad-off-via contacts thereof
INTEL CORP138 citations97
US6173576B1Jan 16, 2001
Cooling unit for an integrated circuit package
INTEL CORP41 citations92
US5660321AAug 26, 1997
Method for controlling solder bump height and volume for substrates containing both pad-on and pad-off via contacts
INTEL CORP31 citations91
US6422303B1Jul 23, 2002
Silent heat exchanger and fan assembly
INTEL CORP16 citations83
US6278185B1Aug 21, 2001
Semi-additive process (SAP) architecture for organic leadless grid array packages
INTEL CORP19 citations79
US6785148B1Aug 31, 2004
Easy mount socket
INTEL CORP8 citations74
US6798137B2Sep 28, 2004
Apparatus and method for warpage compensation of a display panel substrate assembly
INTEL CORP8 citations73
US7171743B2Feb 6, 2007
Apparatus and method for warpage compensation of a display panel substrate assembly
INTEL CORP2 citations62
JDS UNIPHASE CORP
4 patentsUS6697553B2Feb 24, 2004
Compact, low insertion loss, high yield arrayed waveguide grating
JDS UNIPHASE CORP9 citations70
US6665475B2Dec 16, 2003
Precision fiber optic alignment and attachment apparatus
JDS UNIPHASE CORP4 citations62
US6664511B2Dec 16, 2003
Package for optical components
JDS UNIPHASE CORP3 citations62
US6606425B1Aug 12, 2003
Transfer molded packages with embedded thermal insulation
JDS UNIPHASE CORP2 citations62