Inventor

YIU HO-YIN

TW28 patents

⚠️ This page may combine multiple inventors who share the name “YIU HO-YIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YIU HO-YIN

XINTEC INC

Chip package and method for forming the same

Chip package having chip connected to sensing device with redistribution layer in insulator layer

Method for forming chip package having chip connected to sensing device with redistribution layer in insulator layer

Chip package having a laser stop structure

Chip package having a dual through hole redistribution layer structure

Chip package and method for forming the same

Chip package having extended depression for electrical connection and method of manufacturing the same

Chip module and method for forming the same

Chip package and fabrication method thereof

Method of fabricating chip package with laser

Chip package and manufacturing method thereof

Chip scale sensing chip package

Chip package and manufacturing method thereof

Chip package

Chip package and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG

Optical sensor by using tunneling diode

Stress buffered bond pad and method of making

Top via pattern for bond pad structure

Method for fabricating a stress buffered bond pad

Method to preserve the testing chip for package&#39;s quality

Optical sensor by using tunneling diode

Method of using a tunneling diode in optical sensing devices

Low leakage wire bond pad structure for integrated circuits

YIU HO-YIN

Capacitive coupler packaging structure

Power module and the method of packaging the same

Chip package structure and method for forming the same

CHANG SHU-MING

Chip package and method for forming the same

WEN YING-NAN

Chip package and method for forming the same

Method to preserve the testing chip for package's quality