Inventor
NGUYEN MY
US13 patents
⚠️ This page may combine multiple inventors who share the name “NGUYEN MY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HONEYWELL INT INC
5 patentsUS6706219B2Mar 16, 2004
Interface materials and methods of production and use thereof
HONEYWELL INT INC43 citations95
US6673434B2Jan 6, 2004
Thermal interface materials
HONEYWELL INT INC52 citations95
US6605238B2Aug 12, 2003
Compliant and crosslinkable thermal interface materials
HONEYWELL INT INC55 citations94
US7867609B2Jan 11, 2011
Thermal interface materials
HONEYWELL INT INC14 citations92
US6797382B2Sep 28, 2004
Thermal interface materials
HONEYWELL INT INC45 citations88
ALTERA CORP
3 patentsUS6992397B1Jan 31, 2006
Electroless nickel immersion gold semiconductor flip chip package
ALTERA CORP6 citations73
US6756687B1Jun 29, 2004
Interfacial strengthening for electroless nickel immersion gold substrates
ALTERA CORP7 citations73
US7309647B1Dec 18, 2007
Method of mounting an electroless nickel immersion gold flip chip package
ALTERA CORP6 citations62