Inventor
ICHIKAWA MASASHI
JP10 patents
⚠️ This page may combine multiple inventors who share the name “ICHIKAWA MASASHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOSHIBA KK
2 patentsUS7474386B2Jan 6, 2009
Wafer flatness evaluation method, wafer flatness evaluation apparatus carrying out the evaluation method, wafer manufacturing method using the evaluation method, wafer quality assurance method using the evaluation method, semiconductor device manufacturing method using the evaluation method and semiconductor device manufacturing method using a wafer evaluated by the evaluation method
TOSHIBA KK14 citations92
US7365830B2Apr 29, 2008
Wafer flatness evaluation method, wafer flatness evaluation apparatus carrying out the evaluation method, wafer manufacturing method using the evaluation method, wafer quality assurance method using the evaluation method, semiconductor device manufacturing method using the evaluation method and semiconductor device manufacturing method using a wafer evaluated by the evaluation method
TOSHIBA KK4 citations63
NEC CORP
2 patentsNIPPON STEEL CORP
2 patentsUS5047608ASep 10, 1991
Method and apparatus for resistance welding wherein the electrode axis is included with respect to the electrode forcing axis
NIPPON STEEL CORP24 citations91
US4561561ADec 31, 1985
Container having an easy opening end with a tab affixed by ultrasonic welding
NIPPON STEEL CORP11 citations73
SHINETSU HANDOTAI KK
2 patentsUS7203559B2Apr 10, 2007
Method for manufacturing semiconductor wafer, method for receiving order for manufacture of semiconductor wafer, and system for receiving order for manufacture of semiconductor wafer
SHINETSU HANDOTAI KK4 citations60
US7276427B2Oct 2, 2007
Method for manufacturing SOI wafer
SHINETSU HANDOTAI KK6 citations59