Inventor
KIM KYUNG-DU
KR2 patents
Patents
2 patentsUS7518873B2Apr 14, 2009
Heat spreader, semiconductor package module and memory module having the heat spreader
SAMSUNG ELECTRONICS CO LTD20 citations90
US7902664B2Mar 8, 2011
Semiconductor package having passive component and semiconductor memory module including the same
SAMSUNG ELECTRONICS CO LTD3 citations60