Inventor
MENARD ETIENNE
US68 patents
⚠️ This page may combine multiple inventors who share the name “MENARD ETIENNE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNIV ILLINOIS
26 patentsUS9450043B2Sep 20, 2016
Methods and devices for fabricating and assembling printable semiconductor elements
UNIV ILLINOIS79 citations99
US9105555B2Aug 11, 2015
Stretchable form of single crystal silicon for high performance electronics on rubber substrates
UNIV ILLINOIS85 citations99
US8664699B2Mar 4, 2014
Methods and devices for fabricating and assembling printable semiconductor elements
UNIV ILLINOIS338 citations99
US8039847B2Oct 18, 2011
Printable semiconductor structures and related methods of making and assembling
UNIV ILLINOIS282 citations99
US7982296B2Jul 19, 2011
Methods and devices for fabricating and assembling printable semiconductor elements
UNIV ILLINOIS398 citations99
US7943491B2May 17, 2011
Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp
UNIV ILLINOIS398 citations99
US7932123B2Apr 26, 2011
Release strategies for making transferable semiconductor structures, devices and device components
UNIV ILLINOIS342 citations99
US7799699B2Sep 21, 2010
Printable semiconductor structures and related methods of making and assembling
UNIV ILLINOIS450 citations99
US7622367B1Nov 24, 2009
Methods and devices for fabricating and assembling printable semiconductor elements
UNIV ILLINOIS977 citations99
US7557367B2Jul 7, 2009
Stretchable semiconductor elements and stretchable electrical circuits
UNIV ILLINOIS832 citations99
US7521292B2Apr 21, 2009
Stretchable form of single crystal silicon for high performance electronics on rubber substrates
UNIV ILLINOIS561 citations99
US7195733B2Mar 27, 2007
Composite patterning devices for soft lithography
UNIV ILLINOIS514 citations99
US10374072B2Aug 6, 2019
Methods and devices for fabricating and assembling printable semiconductor elements
UNIV ILLINOIS20 citations98
US9768086B2Sep 19, 2017
Methods and devices for fabricating and assembling printable semiconductor elements
UNIV ILLINOIS32 citations98
US9761444B2Sep 12, 2017
Methods and devices for fabricating and assembling printable semiconductor elements
UNIV ILLINOIS32 citations98
US9515025B2Dec 6, 2016
Stretchable form of single crystal silicon for high performance electronics on rubber substrates
UNIV ILLINOIS50 citations98
US9324733B2Apr 26, 2016
Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics
UNIV ILLINOIS71 citations98
US7972875B2Jul 5, 2011
Optical systems fabricated by printing-based assembly
UNIV ILLINOIS596 citations98
US9601671B2Mar 21, 2017
Optical systems fabricated by printing-based assembly
UNIV ILLINOIS24 citations97
US9117940B2Aug 25, 2015
Optical systems fabricated by printing-based assembly
UNIV ILLINOIS52 citations97
US9349900B2May 24, 2016
Release strategies for making transferable semiconductor structures, devices and device components
UNIV ILLINOIS25 citations94
US10204864B2Feb 12, 2019
Stretchable form of single crystal silicon for high performance electronics on rubber substrates
UNIV ILLINOIS12 citations93
US10424572B2Sep 24, 2019
Optical systems fabricated by printing-based assembly
UNIV ILLINOIS8 citations92
US10361180B2Jul 23, 2019
Optical systems fabricated by printing-based assembly
UNIV ILLINOIS10 citations92
US10504882B2Dec 10, 2019
Optical systems fabricated by printing-based assembly
UNIV ILLINOIS7 citations84
US10355113B2Jul 16, 2019
Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics
UNIV ILLINOIS11 citations84
MENARD ETIENNE
6 patentsUS9161448B2Oct 13, 2015
Laser assisted transfer welding process
MENARD ETIENNE149 citations99
US8506867B2Aug 13, 2013
Printing semiconductor elements by shear-assisted elastomeric stamp transfer
MENARD ETIENNE357 citations99
US8261660B2Sep 11, 2012
Vacuum coupled tool apparatus for dry transfer printing semiconductor elements
MENARD ETIENNE174 citations99
US9412727B2Aug 9, 2016
Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion
MENARD ETIENNE99 citations98
US9049797B2Jun 2, 2015
Electrically bonded arrays of transfer printed active components
MENARD ETIENNE68 citations96
US9496155B2Nov 15, 2016
Methods of selectively transferring active components
MENARD ETIENNE39 citations94
ROGERS JOHN A
6 patentsUS8895406B2Nov 25, 2014
Release strategies for making transferable semiconductor structures, devices and device components
ROGERS JOHN A211 citations99
US8754396B2Jun 17, 2014
Stretchable form of single crystal silicon for high performance electronics on rubber substrates
ROGERS JOHN A274 citations99
US8729524B2May 20, 2014
Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics
ROGERS JOHN A148 citations99
US8217381B2Jul 10, 2012
Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics
ROGERS JOHN A195 citations99
US8198621B2Jun 12, 2012
Stretchable form of single crystal silicon for high performance electronics on rubber substrates
ROGERS JOHN A322 citations99
US8470701B2Jun 25, 2013
Printable, flexible and stretchable diamond for thermal management
ROGERS JOHN A289 citations98
BOWER CHRISTOPHER
3 patentsUS8877648B2Nov 4, 2014
Methods of forming printable integrated circuit devices by selective etching to suspend the devices from a handling substrate and devices formed thereby
BOWER CHRISTOPHER249 citations99
US9165989B2Oct 20, 2015
High-yield fabrication of large-format substrates with distributed, independent control elements
BOWER CHRISTOPHER65 citations97
US9142468B2Sep 22, 2015
Structures and methods for testing printable integrated circuits
BOWER CHRISTOPHER31 citations94
NUZZO RALPH G
2 patentsX CELEPRINT LTD
2 patentsGLOBAL OLED TECHNOLOGY LLC
1 patentSEMPRIUS INC
1 patentROGERS JOHN
1 patentMEITL MATTHEW
1 patentHELIOSLITE
1 patentShowing the top 50 of 68 patents by PatentIndex Score.