Inventor
KIM MIN GYUM
KR13 patents
⚠️ This page may combine multiple inventors who share the name “KIM MIN GYUM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG SDI CO LTD
9 patentsUS9868751B2Jan 16, 2018
Phosphonium compound, epoxy resin composition including the same and semiconductor device prepared from the same
SAMSUNG SDI CO LTD3 citations71
US10385161B2Aug 20, 2019
Phosphonium-based compound, epoxy resin composition containing same, semiconductor device manufactured using same
SAMSUNG SDI CO LTD0 citations50
US9890307B2Feb 13, 2018
Phosphonium compound, epoxy resin composition including the same and semiconductor device prepared using the same
SAMSUNG SDI CO LTD0 citations50
US10047191B2Aug 14, 2018
Compound containing phosphonium ion, epoxy resin composition containing same, and device manufactured by using same
SAMSUNG SDI CO LTD0 citations40
US9957348B2May 1, 2018
Pyridiniuivi-based compound, epoxy resin composition comprising same, and apparatus manufactured using same
SAMSUNG SDI CO LTD0 citations40
US9890238B2Feb 13, 2018
Curing catalyst for epoxy resin composition, epoxy resin composition comprising same, and apparatus manufactured by using same
SAMSUNG SDI CO LTD0 citations40
US9870971B2Jan 16, 2018
Epoxy resin composition for encapsulating a semiconductor device and semiconductor device prepared using the same
SAMSUNG SDI CO LTD0 citations39
US9850390B2Dec 26, 2017
Epoxy resin composition for encapsulating semiconductor device and semiconductor device prepared using the same
SAMSUNG SDI CO LTD0 citations39
US9896465B2Feb 20, 2018
Phosphonium compound, preparation method thereof, epoxy resin composition including the same, and semiconductor device prepared by using the same
SAMSUNG SDI CO LTD0 citations34
KIM MIN GYUM
2 patentsUS9428632B2Aug 30, 2016
Quaternary phosphonium salt, epoxy resin composition for encapsulating semiconductor device and including the quaternary phosphonium salt, and semiconductor device encapsulated with the epoxy resin composition
KIM MIN GYUM1 citations45
US9695294B2Jul 4, 2017
Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated using the same
KIM MIN GYUM0 citations35