Inventor
CHONG NUI
US20 patents
⚠️ This page may combine multiple inventors who share the name “CHONG NUI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
XILINX INC
16 patentsUS10692837B1Jun 23, 2020
Chip package assembly with modular core dice
XILINX INC35 citations93
US11119146B1Sep 14, 2021
Testing of bonded wafers and structures for testing bonded wafers
XILINX INC13 citations85
US11054461B1Jul 6, 2021
Test circuits for testing a die stack
XILINX INC12 citations84
US11164749B1Nov 2, 2021
Warpage reduction
XILINX INC7 citations83
US7673270B1Mar 2, 2010
Method and apparatus for compensating an integrated circuit layout for mechanical stress effects
XILINX INC14 citations82
US11650249B1May 16, 2023
Wafer testing and structures for wafer testing
XILINX INC4 citations75
US10756711B1Aug 25, 2020
Integrated circuit skew determination
XILINX INC2 citations73
US10629512B2Apr 21, 2020
Integrated circuit die with in-chip heat sink
XILINX INC4 citations73
US9177634B1Nov 3, 2015
Two gate pitch FPGA memory cell
XILINX INC5 citations73
US11585854B1Feb 21, 2023
Runtime measurement of process variations and supply voltage characteristics
XILINX INC6 citations71
US11114344B1Sep 7, 2021
IC die with dummy structures
XILINX INC1 citations62
US10043724B1Aug 7, 2018
Using an integrated circuit die for multiple devices
XILINX INC1 citations52
US12045469B2Jul 23, 2024
Single event upset tolerant memory device
XILINX INC0 citations51
US10103139B2Oct 16, 2018
Method and design of low sheet resistance MEOL resistors
XILINX INC0 citations41
US10566050B1Feb 18, 2020
Selectively disconnecting a memory cell from a power supply
XILINX INC0 citations40
US10379155B2Aug 13, 2019
In-die transistor characterization in an IC
XILINX INC0 citations37